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LPKF has developed a laser-based procedure for the production of MID's (Molded Interconnect Devices) called the LPKF-LDS Process. With LPKF�s Laser Direct Structuring process (LDS), it is possible to produce circuit layouts on complex three-dimensional carrier structures directly into the molded plastic part.
LPKF has developed a laser-based procedure for the production of MID's (Molded Interconnect Devices) called the LPKF-LDS Process. With LPKF�s Laser Direct Structuring process (LDS), it is possible to produce circuit layouts on complex three-dimensional carrier structures directly into the molded plastic part.
Hosted by: Joe Desposito Edited by: Curtis Ellzey








This group of luminaries from the formative years of the laser expresses both wonder and delight at the astonishing ubiquity this technology has achieved in their lifetime. They recount their parts of a 50-year tale, and convey the excitement of scientific discovery and the pleasures of advancing knowledge in a new field.