Joe Desposito, Electronic Design's Editor-in-Chief, reviews a 3D printer that jets two different materials at the same time to speed up design development.
Hosted by: Joe Desposito Videography by: Megan Paznik Edited by: Megan Paznik
Joe Desposito of Electronic Design magazine talks with Mark Larson, President of Digi-Key about the company, where it's been, where it's going and what they have planned for the future of component supply.Hosted by: Joe Desposito Videography by: Paul Milnamow Edited by: Terry Knight
LPKF has developed a laser-based procedure for the production of MID's (Molded Interconnect Devices) called the LPKF-LDS Process. With LPKF�s Laser Direct Structuring process (LDS), it is possible to produce circuit layouts on complex three-dimensional carrier structures directly into the molded plastic part.
Hosted by: Joe Desposito Edited by: Curtis Ellzey
Paul Whytock of Electronic Design magazine talks with Derek Imschweiler of Bel about their newest addition to their product line, a category 6A modular plug.Hosted by: Joe Desposito Videography by: Paul Milnamow Edited by: Terry Knight
Introduced at Electronica 2010, the new Anritsu MS2036C includes a powerful spectrum analyzer which multiplies user convenience by combining spectrum analysis with the VNA into a single measurement powerhouse for RF field test.
Hosted by: Paul Whytock Edited by: Curtis Ellzey
The latest generation ZMOTION Module from Zilog features advance sensing and control technology. It consists of a of high-performance microcontroller with unique embedded software specifically designed for products requiring control based on Passive Infrared (PIR) motion detection.
Hosted by: Joe Desposito Edited by: Curtis Ellzey
Paul Whytock visits Sensirion and gets an overview of their new SHT21 and SHT25 fully calibrated digital humidity and temperature sensors.Hosted by: Joe Desposito Videography by: Paul Milnamow Edited by: Terry Knight
At Electronica 2010, Nigel Springett, Consulting Applications Engineer at SemiSouth Laboratories, discusses their breakthrough Silicon Carbide (SiC) technology which enables power conversion applications to benefit from dramatic improvements in efficiency and switching, as well as thermal performance.
Hosted by: Paul Whytock Edited by: Curtis Ellzey
At Electronica 2010, Oleg Khaykin, International Rectifier's President and CEO, talked with Electronic Design Europe Editor-in-Chief Paul Whytock about recent strides in their GaN (gallium arsenide) technology and their successes in the European market.
Hosted by: Paul Whytock Edited by: Curtis Ellzey
Paul Whytock of Electronic Design Europe talks with Antonio Trovato of Tyco Electronics about, an industry-first Reflowable Thermal Protection (RTP) Device that protects against thermal runaway. Hosted by: Joe Desposito Videography by: Paul Milnamow Edited by: Terry Knight
