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LPKF-LDS: 3D Circuitry for Molded Interconnect Devices
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LPKF has developed a laser-based procedure for the production of MID's (Molded Interconnect Devices) called the LPKF-LDS Process. With LPKF�s Laser Direct Structuring process (LDS), it is possible to produce circuit layouts on complex three-dimensional carrier structures directly into the molded plastic part.
For more techical information visit our sister website www.engineeringmaintenance.info or for equipment procurement please visit www.engineeringtrader.com
LPKF has developed a laser-based procedure for the production of MID's (Molded Interconnect Devices) called the LPKF-LDS Process. With LPKF�s Laser Direct Structuring process (LDS), it is possible to produce circuit layouts on complex three-dimensional carrier structures directly into the molded plastic part.
Hosted by: Joe Desposito Edited by: Curtis Ellzey
For more techical information visit our sister website www.engineeringmaintenance.info or for equipment procurement please visit www.engineeringtrader.com
