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EoPlex QFN Multi Row (QFN-MR) Molded Array Package Substrate
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EoPlex QFN Multi Row (QFN-MR) Molded Array Package Substrate platform technology is a clean additive process that uses proprietary deposition techniques and materials to produce ceramic-metal or metal-polymer components, such as cell phone antennas and the micro semiconductor packages.
For more techical information visit our sister website www.engineeringmaintenance.info or for equipment procurement please visit www.engineeringtrader.com
EoPlex QFN Multi Row (QFN-MR) Molded Array Package Substrate platform technology is a clean additive process that uses proprietary deposition techniques and materials to produce ceramic-metal or metal-polymer components, such as cell phone antennas and the micro semiconductor packages.
Hosted by: Don Tuite Videography by: EoPlex Edited by: EoPlex
For more techical information visit our sister website www.engineeringmaintenance.info or for equipment procurement please visit www.engineeringtrader.com
