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# Article Title Hits
101 Maxim InTune Digital Power Features "State-Space" DC-DC Control Technology 1038
102 Cree Demonstrates the Industry's First True SiC MOSFET at APEC 2011 1082
103 Mouser's Business Strategies 1060
104 Single Channel Hi-Speed USB to Multipurpose UART/FIFO IC 2
105 Windows Embedded Compact 1047
106 The New High Performance 8-bit Microcontroller from Microchip 1154
107 The MSO/DPO5000 Mixed Signal Oscilloscope Series from Tektronix 118
108 The IMST iM871A Wireless M-Bus Module for Smart Metering 510
109 IDT Developments Including Communications, Computing and the Consumer 442
110 Texas Instruments: Implementing battery monitoring technology for UPS 446
111 Texas Instruments: bqTESLA Development Kit Overview Qi Compliant Wireless Power 485
112 AWR: Symbol Generation Wizard 463
113 National Semiconductor: LMP90100/LMP91000 Sensor AFE Overview -
114 Texas Instruments: TPA2015D1: Boosted Class-D Audio Amp Demo 524
115 Texas Instruments: Audio Amp with SmartGain - TPA2028D1 & TPA2026D2 573
116 Texas Instruments: TPA2051D3 - Speaker Protection Demonstration 454
117 Texas Instruments: Digital Filter Calculation - Demo 478
118 Texas Instruments: Reducing Excessive Noise in Audio Systems 486
119 Texas Instruments: Class-D Amps for Netbooks 530
120 Texas Instruments: PCB Layout Considerations when using Audio Amps 495
121 Texas Instruments: Limiting Crosstalk in Audio Applications 455
122 Texas Instruments: How to Improve SNR in Audio Systems using a Series Resistor 502
123 Freescale i.MX 6 Multimedia Applications Processors -
124 Energy Micro Ultra Low Power Microcontrollers 603
125 Atmel's Multitouch Technology 542
126 Making Multiple Temperature Sensors Easy 447
127 Serial Flash Memory From Atmel 543
128 Cree Sheds Some Light on LED Characteristics 503
129 MultiTouch Technology Readies To Change The World Of Interactive Displays 491
130 Sensor Fusion: The Freescale MAG3110 493
131 3D Television Viewing with Wireless Communications 460
132 Tektronix: 3rd Generation Real-Time Signal Analyzer 461
133 Integrating Digital and Analog Technology in Chips and Modules 471
134 Design of Linear Technology's Single-Stage Ballast Chip 475
135 Linear Technology CTO Robert Dobkin Offers Opinions About Analog Chip Makers and Foundries 505
136 Organizing and Planning IEEE GlobeCom 509
137 The Technological University of America 445
138 The Communications Society within IEEE 449
139 Creative Destruction in Broadband 461
140 Building the Program of IEEE GlobeCom 430
141 Atmel AVR: The Beginning of an 8-bit MCU 413
142 Retrofitting and Future-Proofing LED Design Strategies from Arrow Electronics 466
143 Atmel AVR Architecture 579
144 Atmel AVR Family Overview 560
145 Wireless Network and Product Integrity 476
146 The Future of Wireless Communications 477
147 Reducing Energy Consumption with LEDs at Southern California Edison 464
148 Cree Sheds Light on LED Characteristics 467
149 IBM: Agile development for real-time Embedded application (1 of 6) 473
150 IBM: Agile development for real-time Embedded application (Part 2 of 6) 440
151 IBM: Agile development for real-time Embedded application (Part 4 of 6) 541
152 IBM: Agile development for real-time Embedded application (Part 5 of 6) 524
153 IBM: Agile development for real-time Embedded application (Part 6 of 6) 478
154 IBM: Agile development for real-time Embedded application (Part 3 of 6) 561
155 CUI Releases New Digital DC-DC POL Module Series 476
156 Audio Precision APx515 Audio Analyzer Demo 522
157 Digital Connectivity and New Technology Trends from Audio Precision 464
158 Advanced Power Electronics Corp. at Electronica 2010 -
159 Tektronix Continues Upgrading Benchtop Scopes 468
160 C&K Clicker Transforms Touch Screens and Touch Pads to Clickable Devices 636
161 Infineon 120W LED Street Light Power Supply Solution 489
162 LED Value Add Proof of Concept Capabilities from Arrow Electronics 612
163 AWR: Tutorial - Using TX-Line 593
164 AWR: AXIEM - Differential Ports 593
165 AWR: AXIEM - In-Situ Current 446
166 AWR: AXIEM - Gridless Mesh 491
167 Objet Geometries: 3D Printing With a Difference 474
168 The Component Vision of Digi-Key 523
169 LPKF-LDS: 3D Circuitry for Molded Interconnect Devices 535
170 Bel Modular Plugs 433
171 Anritsu MS2038C VNA Master + Spectrum Analyzer 462
172 Zilog ZMOTION Module Featuring PIR Technology 495
173 Digital Humidity and Temperature Sensors from Sensirion 456
174 SemiSouth Silicon Carbide (SiC) Technology 532
175 International Rectifier's GaN Technology Making Significant Strides 518
176 Reflowable Thermal Protection Devices from Tyco Electronics 499
177 Texas Instruments: A Perfect 10 � Industry�s first 10-GHz fixed/floating point DSP: New C66x Multicore DSPs 76
178 Texas Instruments: Industry�s first wireless base station SoC with 4G class performance: TCI6616 SoC and KeyStone architecture 364
179 Texas Instruments: Unleashing full multicore entitlement: KeyStone multicore architecture for C66x DSPs 407
180 Texas Instruments: DSP core and memory architecture improvements: KeyStone multicore architecture for C66x DSPs 432
181 Texas Instruments: Ask the Expert: Why is floating-point capability beneficial for base station implementations? 670
182 Texas Instruments: Ask the Expert: TI�s single chip small cell SoC has reduced the analog componentry at the board level; how is this achieved? 511
183 Texas Instruments: Ask the Expert: The new C66x DSP benchmarks reflect up to a 5x improvement in performance over other cores. How is this achieved? -
184 Texas Instruments: Ask the Expert: When are 4 DSP cores better for performance than 6 or more? 673
185 Texas Instruments: Ask the Expert: How have TI tools helped to accelerate customer development the TCI6616? 568
186 Texas Instruments: Ask the Expert: How is TI helping base station vendors reduce service provider electrical power costs, achieving more �green� operations? 494
187 Texas Instruments: Ask the Expert: How has your wireless base station SoC strategy changed over the last ten years? 842
188 Texas Instruments: Ask the Expert: Why is the KeyStone architecture so good for executing Layer 2 functionality? 716
189 Texas Instruments: Dig Deeper - Important Considerations for Selecting a Multicore SoC 448
190 LPK ProtoLaser S: PCBs at the Press of a Button 543
191 Global Semiconductor Alliance Closes NASDAQ on a High Note 498
192 Lattice Semiconductor: Introducing MachXO2 - The Do-it-All PLD 470
193 Digi-Key, Marilyn Monroe and a Corvette 528
194 EoPlex QFN Multi Row (QFN-MR) Molded Array Package Substrate 676
195 Microchip Stand-alone I�C Real-Time Clock/Calendar (RTCC) -
196 Texas Instruments: ControlSUITE Desktop 732
197 Texas Instruments: Crosshairs Embedded 395
198 Silicon Labs Si824x Class D Audio Driver 488
199 Texas Instruments: TPS84620 Demo: 6-A, 14.5-V Point-of-Load Solution -
200 Texas Instruments: Compact Power -- 600-mA fully integrated step-down solution 514