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101 Intersil's ZL9101M Digital Power Module Saves Space and Reduces BOM 1291
102 Maxim InTune Digital Power Features "State-Space" DC-DC Control Technology 1152
103 Cree Demonstrates the Industry's First True SiC MOSFET at APEC 2011 1155
104 Mouser's Business Strategies 1126
105 Single Channel Hi-Speed USB to Multipurpose UART/FIFO IC 2
106 Windows Embedded Compact 1096
107 The New High Performance 8-bit Microcontroller from Microchip 1219
108 The MSO/DPO5000 Mixed Signal Oscilloscope Series from Tektronix 139
109 The IMST iM871A Wireless M-Bus Module for Smart Metering 560
110 IDT Developments Including Communications, Computing and the Consumer 488
111 Texas Instruments: Implementing battery monitoring technology for UPS 493
112 Texas Instruments: bqTESLA Development Kit Overview Qi Compliant Wireless Power 531
113 AWR: Symbol Generation Wizard 505
114 National Semiconductor: LMP90100/LMP91000 Sensor AFE Overview -
115 Texas Instruments: TPA2015D1: Boosted Class-D Audio Amp Demo 566
116 Texas Instruments: Audio Amp with SmartGain - TPA2028D1 & TPA2026D2 639
117 Texas Instruments: TPA2051D3 - Speaker Protection Demonstration 496
118 Texas Instruments: Digital Filter Calculation - Demo 523
119 Texas Instruments: Reducing Excessive Noise in Audio Systems 555
120 Texas Instruments: Class-D Amps for Netbooks 586
121 Texas Instruments: PCB Layout Considerations when using Audio Amps 536
122 Texas Instruments: Limiting Crosstalk in Audio Applications 500
123 Texas Instruments: How to Improve SNR in Audio Systems using a Series Resistor 540
124 Freescale i.MX 6 Multimedia Applications Processors -
125 Energy Micro Ultra Low Power Microcontrollers 661
126 Atmel's Multitouch Technology 598
127 Making Multiple Temperature Sensors Easy 478
128 Serial Flash Memory From Atmel 598
129 Cree Sheds Some Light on LED Characteristics 570
130 MultiTouch Technology Readies To Change The World Of Interactive Displays 530
131 Sensor Fusion: The Freescale MAG3110 557
132 3D Television Viewing with Wireless Communications 519
133 Tektronix: 3rd Generation Real-Time Signal Analyzer 510
134 Integrating Digital and Analog Technology in Chips and Modules 529
135 Design of Linear Technology's Single-Stage Ballast Chip 534
136 Linear Technology CTO Robert Dobkin Offers Opinions About Analog Chip Makers and Foundries 560
137 Organizing and Planning IEEE GlobeCom 570
138 The Technological University of America 496
139 The Communications Society within IEEE 503
140 Creative Destruction in Broadband 511
141 Building the Program of IEEE GlobeCom 472
142 Atmel AVR: The Beginning of an 8-bit MCU 443
143 Retrofitting and Future-Proofing LED Design Strategies from Arrow Electronics 502
144 Atmel AVR Architecture 645
145 Atmel AVR Family Overview 621
146 Wireless Network and Product Integrity 518
147 The Future of Wireless Communications 533
148 Reducing Energy Consumption with LEDs at Southern California Edison 519
149 Cree Sheds Light on LED Characteristics 506
150 IBM: Agile development for real-time Embedded application (1 of 6) 516
151 IBM: Agile development for real-time Embedded application (Part 2 of 6) 476
152 IBM: Agile development for real-time Embedded application (Part 4 of 6) 605
153 IBM: Agile development for real-time Embedded application (Part 5 of 6) 580
154 IBM: Agile development for real-time Embedded application (Part 6 of 6) 520
155 IBM: Agile development for real-time Embedded application (Part 3 of 6) 625
156 CUI Releases New Digital DC-DC POL Module Series 527
157 Audio Precision APx515 Audio Analyzer Demo 573
158 Digital Connectivity and New Technology Trends from Audio Precision 490
159 Advanced Power Electronics Corp. at Electronica 2010 -
160 Tektronix Continues Upgrading Benchtop Scopes 522
161 C&K Clicker Transforms Touch Screens and Touch Pads to Clickable Devices 704
162 Infineon 120W LED Street Light Power Supply Solution 532
163 LED Value Add Proof of Concept Capabilities from Arrow Electronics 674
164 AWR: Tutorial - Using TX-Line 641
165 AWR: AXIEM - Differential Ports 651
166 AWR: AXIEM - In-Situ Current 469
167 AWR: AXIEM - Gridless Mesh 527
168 Objet Geometries: 3D Printing With a Difference 529
169 The Component Vision of Digi-Key 571
170 LPKF-LDS: 3D Circuitry for Molded Interconnect Devices 578
171 Bel Modular Plugs 479
172 Anritsu MS2038C VNA Master + Spectrum Analyzer 513
173 Zilog ZMOTION Module Featuring PIR Technology 545
174 Digital Humidity and Temperature Sensors from Sensirion 500
175 SemiSouth Silicon Carbide (SiC) Technology 576
176 International Rectifier's GaN Technology Making Significant Strides 558
177 Reflowable Thermal Protection Devices from Tyco Electronics 549
178 Texas Instruments: A Perfect 10 � Industry�s first 10-GHz fixed/floating point DSP: New C66x Multicore DSPs 94
179 Texas Instruments: Industry�s first wireless base station SoC with 4G class performance: TCI6616 SoC and KeyStone architecture 412
180 Texas Instruments: Unleashing full multicore entitlement: KeyStone multicore architecture for C66x DSPs 441
181 Texas Instruments: DSP core and memory architecture improvements: KeyStone multicore architecture for C66x DSPs 474
182 Texas Instruments: Ask the Expert: Why is floating-point capability beneficial for base station implementations? 765
183 Texas Instruments: Ask the Expert: TI�s single chip small cell SoC has reduced the analog componentry at the board level; how is this achieved? 568
184 Texas Instruments: Ask the Expert: The new C66x DSP benchmarks reflect up to a 5x improvement in performance over other cores. How is this achieved? -
185 Texas Instruments: Ask the Expert: When are 4 DSP cores better for performance than 6 or more? 794
186 Texas Instruments: Ask the Expert: How have TI tools helped to accelerate customer development the TCI6616? 655
187 Texas Instruments: Ask the Expert: How is TI helping base station vendors reduce service provider electrical power costs, achieving more �green� operations? 548
188 Texas Instruments: Ask the Expert: How has your wireless base station SoC strategy changed over the last ten years? 934
189 Texas Instruments: Ask the Expert: Why is the KeyStone architecture so good for executing Layer 2 functionality? 845
190 Texas Instruments: Dig Deeper - Important Considerations for Selecting a Multicore SoC 504
191 LPK ProtoLaser S: PCBs at the Press of a Button 597
192 Global Semiconductor Alliance Closes NASDAQ on a High Note 573
193 Lattice Semiconductor: Introducing MachXO2 - The Do-it-All PLD 502
194 Digi-Key, Marilyn Monroe and a Corvette 580
195 EoPlex QFN Multi Row (QFN-MR) Molded Array Package Substrate 727
196 Microchip Stand-alone I�C Real-Time Clock/Calendar (RTCC) -
197 Texas Instruments: ControlSUITE Desktop 823
198 Texas Instruments: Crosshairs Embedded 430
199 Silicon Labs Si824x Class D Audio Driver 519
200 Texas Instruments: TPS84620 Demo: 6-A, 14.5-V Point-of-Load Solution -